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 05143
SL VDA2.8LC
Only One Name Means ProT ek'TionTM
UL TRA LOW CAPACIT ANCE TVS ARRA Y
APPLICA TIONS Ethernet - 10/100/1000 Base T Cellular Phone Base Stations Switching Stations Audio/Video Inputs Handheld Devices IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 61000-4-5 (Surge): 24A, 8/20s - Level 2(Line-Ground) & Level 3(Line-Line) FEA TURES 600 Watts Peak Pulse Power per Line (tp = 8/20s) Provides Protection for Four (4) Line Pairs LOW LEAKAGE CURRENT < 1.0A ULTRA LOW CAPACITANCE: 1.25pF RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS Molded JEDEC SO-8 Weight 70 milligrams (Approximate) Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Pure-Tin - Sn, 100: 260-270C Flammability Rating UL 94V-0 12mm Tape and Reel Per EIA Standard 481 Device Marking: Marking Code, Logo, Date Code & Pin One Defined By DOT on Package
SO-8
PIN CONFIGURA TION
8
7
6
5
1
2
3
4
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SL VDA2.8LC
DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Peak Pulse Current (tp = 8/20s) Lead Soldering Temperature Operating Temperature Storage Temperature SYMBOL PPP IPP TII TJ TSTG VALUE 600 30 260C (10 Sec) -55C to 150C -55C to 150C UNITS Watts A C C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER DEVICE MARKING CODE RATED STAND-OFF VOLTAGE MINIMUM MINIMUM BREAKDOWN SNAP BACK VOLTAGE VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 42) MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE
V WM VOLTS SLVDA2.8LC LV2.8 2.8
@ 1mA V(BR) VOLTS 3.0
@ ISB = 50mA V SB VOLTS 2.8
@IP = 1A VC VOLTS 4.6
@IP = 5A VC VOLTS 6.2
@8/20s VC @ IPP 21.0V@30.0A
@V WM ID A 1.0
@0V, 1MHz C pF 5
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000
600W, 8/20s Waveform
e-t
100
td = t I /2 PP
10 0.01
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
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SL VDA2.8LC
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20s
100 80
% Of Rated Power
60
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
FIGURE 4 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 20
VC - Clamping Voltage - V
16 12 8 4 0
0
5
10 15 20 25 IPP - Peak Pulse Current A
30
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SL VDA2.8LC
APPLICA TION NOTE
Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightning effects. Knowing that equipment can be damaged, the SLVDA2.8LC was designed to provide the level of protection required to safe guard sensitive high speed data circuits. This product can be used to provide a level of protection to meet bidirectional requirements either in a common-mode or differential-mode configuration. BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1) The SLVDA2.8LC can provide up to four (4) lines of protection in a common-mode configuration as depicted in Figure 1. Circuit connectivity is as follows: Line 1 is connected to pin 8 Line 2 is connected to pin 7 Line 3 is connected to pin 6 Line 4 is connected to pin 5 Pins 1, 2, 3, and 4 are connected to ground Figure 1: Bidirectional Common-Mode Protection
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 2) The SLVDA2.8LC can provide up to four line pairs (4) of protection in a differential-mode configuration as depicted in Figure 2. Circuit connectivity is as follows: Line Pair # 1 is connected to pin 8 and 1 Line Pair # 2 is connected to pin 7 and 2 Line Pair # 3 is connected to pin 5 and 4 Line Pair # 4 is connected to pin 6 and 3
Figure 2: Bidirectional Differential-Mode Protection
CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.

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SL VDA2.8LC
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
-A-
SO-8
8
5 -B - P
+ 0.010 (0.25 MM) M B M 4 PL
DIM A B C D F G J K P R
NOTES 1. 2. 3. 4. 5. 6.
PACKAGE DIMENSIONS MILLIMETERS MIN MAX 4.80 3.80 1.35 0.35 0.40 1.27 BSC 0.18 0.10 5.80 0.25 INCHES MIN MAX
1
4
G
D C R x 45 0 - 10
K 0.010 (0.25 MM) M T B S A S 8 PL
-T-
+
J
F
5.00 0.189 0.196 4.00 0.150 0.157 0.054 0.068 1.75 0.49 0.014 0.019 0.049 1.250 0.016 1.27 BSC 0.05 BSC 0.05 BSC 0.25 0.007 0.009 0.004 0.008 0.25 6.20 0.229 0.244 0.019 0.50 0.010
MOUNTING PAD
0.050 0.005 0.030 0.005
- T - = Seating Plane and Datum Surface. Dimensions "A" and "B" are Datum. Dimensions "A" and "B" do not include mold protrusion. Maximum mold protrusion is 0.015" (0.380 mm) per side. Dimensioning and tolerances per ANSI Y14.5M, 1982. Dimensions are exclusive of mold flash and metal burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 12mm tape, i.e., SLVDA2.8LC-T7. 3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 12mm tape, i.e., SLVDA2.8LC-T13. 4. Suffix - LF = Lead-Free Pure-Tin Plating, i.e., SLVDA2.8LC-LF-T7. 5. No Suffix = Product Shipped in Tubes of 98 pcs per Tube.
0.160 0.005
0.245 MIN
0.045 0.005
Outline & Dimensions: Rev 1 - 11/01, 06009
COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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